Prof. Jin

Rajendra

NSOM PCS

small LED

Device fabrication

Our laboratory is equipped with a unique set of facilities for the III-nitride device fabrication. These include:
  • A STS Multiplex Plasma Enhanced Chemical Vapor Deposition (PECVD) system which is used for the deposition of high quality dielectric mirrors and passivation layers, etc.
  • A production scale e-beam evaporation system for the deposition of metal contacts as well as dielectric materials.
  • A research scale e-beam evaporation system for the deposition of metal contacts as well as dielectric materials.
  • SEM (LEO-440) based e-beam lithography system for nano-scale device patterning with a line resolution of about 30 nm (60 nm) for conducting (insulating) substrate.
  • A deep UV photolithography systems for sub-micron device patterning (0.25 micron line resolution).
  • Plasma-Therm Series 790 Inductively Coupled Plasma (ICP) etching system for dry etching and device pattern transfer.
  • Single-wafer rapid thermal annealing furnace (reaches 1200 C in 5 seconds).
  • Multi-wafer thermal annealing furnace (up to 900 C).
  • High temperature thermal annealing furnace (up to ~1900 C).
  • A laser-lift-off (LLO) system for sapphire substrate removal. A unique feature of our LLO system is that it is able to remove the whole 2” wafers aligning free.
  • Flip-chip bonding system (RD Automation) is used for device packaging and for bump-mounting individual or arrays of devices onto sub-mounts or other driving/read-out circuits.
  • Automated wafer scribe/dicing system (Dynatex).
  • Sapphire wafer lapping/polishing systems.
  • Pulse source meters, LED and laser diode drivers.
  • Probe stations, wire bonders, micromanipulators, optical microscopes with digital cameras for LED and laser diode characterization.
  • Tektronix programmable curve tracer and 45 GHz analog and digital oscilloscopes.
  • Ocean Optics spectrometers for electroluminescent emission characterization for deep UV, UV, and visible emitters.
  • High sensitivity spectrometers for electroluminescent emission characterization of IR emitters.
  • Optical transmission/reflectance spectroscopy measurement setup.
  • Standard AM1.5 solar simulator for determining external efficiencies of various solar cells.

Safety Operation Procedures
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