Dr. Hong C. Zhang
Professor
Department of
Industrial Engineering
Registered Professional Engineer - Texas
Education
B.S. Mechanical Engineering, Tianjin University of Science and Technology 1976
M.S. Mechanical Engineering, University of Aalborg-Denmark 1986
Ph.D. Manufacturing Engineering, Technical University of Denmark 1989
Years of Service at Texas Tech University, dates of appointment
1990-1995 Assistant Professor of Industrial Engineering
1995-2000 Associate Professor of Industrial Engineering
2000-present Professor of Industrial Engineering
2000-2006 Director of the Center for Applied Research in Advanced Manufacturing
Other related experience
2006-2007 Chang Jian Visiting Professor, Hefei University of Technology, Hefei, China
1998 Visiting Assoc. Prof., Dept. of Mfg. Engr., Technical University of Denmark
1998 Visiting Assoc. Prof., Inst. of Mfg. Engr., Hsinghua University, Beijing, China
1998 Visiting Assoc. Prof., Dept. of Mech. Engr., Swiss Federal Inst. of Tech., Switzerland
State(s) in which registered
Texas
Principal publications (past five years)
Book Chapters
“Disassembly for End-of-Life Electromechanical Products,” Chapter 9 of Environmentally Conscious Manufacturing, John Wiely & Sons, Inc., pp211-264, 2007
Articles in Archival Journals
“Design for Environment: An Environmentally Consciour Analysis Model for Modular Design,” IEEE Transactions on Electronics Packaging Manufacturing, Vol. 32, no. 3, pp: 164-175, 2009. (Xueqing Qian and Hong C. Zhang).
“Transdisciplinary Approaches for Teaching and Assessing Sustainable Design,” International Journal of Engineering Education, pressing, 2009 (Derrick Tate, Timothy Maxwell, Atila Ertas, Hong-Chao Zhang, Urs Peter Flueckiger, William Lawson, Dean Fontenot, John Chandler).
“Asymmetric negotiation based collaborative product design for component reuse in disparate products,” An International Journal Computers and Industrial Engineering, Vol. 57, No.1, pp.80-90, 2009. (Jianzhi Li, Hong-Chao Zhang, Zhangxi Lin).
“Removal force models for component disassembly from waste printed circuit board,” International Journal of Sustainable Resource Management and Environmental Efficiency, Vol.53, No. 8, pp.448-454, 2009. (Jiping Yang, Dong Xiang, Jinsong Wang, Guanghong Duan, Hong-Chao Zhang).
“Use of an Energy-Saving Concept to Assess Life-Cycle Impact in Engineering,” the International Journal of Sustainable Manufacturing, Vol. 3, pressing 2009. (Hua Li, Hong-Chao Zhang, and John Carrel).
“Overview of Active Disassembly for Electronics Products,” the International Journal of Sustainable Engineering, Vol. 3, pressing, 2009. (John Carrel, Hong-Chao Zhang, and Hua Li)
“Application of Neural Network on Environmental Impact Assessment Tools,” the International Journal of Sustainable Manufacturing, Vol. 1, No. ½, pp100-121, 2008. (Jianzhi Li, Zhenhua Wu, and Hong-Chao Zhang,)
“A Multi-objective Fuzzy Graph Approach for Modular Formulation Considering end-of-life Issues,” the International journal of Production Research, Vol. 46 No. 14 pp: 4011-4033, 2008. (Jianzhi Li, Hong-Chao Zhang, Miguel Gonzalez and Steven Yu). (SCI, EI).
“Experimental Studies on Cryogenic Recycling of Printed Circuit Board,” the International Journal of Advanced Manufacturing Technology, Vol. 34, no. 7-8, pp 657-666, 2007. (Chris Yuan, Hong C. Zhang, Gregory B. McKenna, and Carol Kozeniewski). (SCI, EI).
“Printed Circuit Board Recycling Process and Its Environmental Impact Assessment,” the International Journal of Advanced Manufacturing Technology, Vol. 34, no. 9-10, pp 1030-1036, 2007. (Dong Xiang, Peng Meng, Jinsong Wang, Guanghong Duan and Hong C. Zhang). (SCI, EI).
“A decision support model based on a reference point method for end-of-life electronic product management,” the International Journal of Advanced Manufacturing Technology, Vol. 31, no. 11-12, pp 1251-1259, 2007. (Kai Jin and Hong-C. Zhang). (SCI, EI).
“Research in green modularity design methodology”, Journal of Shanghai Jiaotong University (Science), Vol. 10E, no. 4, pp 402-406, 2005. (Li Fang-Yi, Li, Jian-Feng, Duan Guang-Hong, Zhang Hong-Chao, Xu Jin-Yong, Ma Kai-Ling). (EI)
Articles in Refereed Conference and Symposium Proceedings
“End-of-Life Analysis of Analog CATV Converters”. Proceedings of the 2009 IEEE International Symposium on Sustainable Systems & Technology (ISSST), CD, (John Carrell, Hong-Chao Zhang, Hua Li, and Chengcheng Fan).
“Research on Quantitative Assessment Methods of Environmental Performance in Green Design,” the proceeding of The15th CIRP International Conference on Life Cycle Engineering, March 2008, Sydney, pp. 136-141, (Zhifeng Liu, Bingbing Li, Haihong Huang and Hong-Chao Zhang).
“Studies on Waste Printed Circuit Board Recycling Using Supercritical Fluid CO2”, the proceeding of The15th CIRP International Conference on Life Cycle Engineering, March 2008, Sydney, pp. 600-603) (Liu Zhifeng, Baozhen Zhang, and Hong-Chao Zhang).
“Improvement of home appliances design based on energy-saving concept: Case studies on hair dryer and coffee maker”. Proceedings of the 2008 IEEE International Symposium on Electronics & the Environment, CD, (Hua Li, Hong-Chao Zhang, Derrick Tate). (SCI, EI).
“ Use of an Energy-Saving Concept to Assess Life-Cycle Impact in Engineering,” accepted by The15th CIRP International Conference on Life Cycle Engineering, March 2008, Sydney, (Hua Li and Hong-Chao Zhang).
“Review of Current End-of-Life Options for Electronics and Future Automatic Disassembly Options with Shape Memory Materials with Carbon Nanotubes for Electronics,” accepted by The15th CIRP International Conference on Life Cycle Engineering, March 2008, Sydney, (John Carrel and Hong-Chao Zhang).
“Energy-saving Based Innovative Product Design Method”, Proceedings of the 2007 IEEE International Symposium on Electronics & the Environment, pp.134-136, 2007, (Hua Li, Hong-Chao Zhang, Derrick Tate),
“Integrating Energy-saving Concept into General Product Design”, 32nd International Electronics Manufacturing Technology Symposium, pp. 335-338, 2007, (Hua Li, Hong-Chao Zhang, Derrick Tate, John Carrell),
“An Environmentally Benign Process Model Development for Printed Circuit Board Recycling,” Proceedings of the IEEE International Symposium on Electronics and the Environment, pp. 212-217, 2006, ( Hong-Chao Zhang, Xi Ouyang and Alex Abadi),
“A Quantitative Reverse Logistics Model and Waste Application for Electronic Products,” Proceedings of the IEEE International Symposium on Electronics and the Environment, pp. 356, 2006, ( Hua Song, Surya Liman, Hong-Chao Zhang, and Alex Abadi),
“Environmental Impact Assessment Method Based Synthesis Weight,” Proceedings of the IEEE International Symposium on Electronics and the Environment, pp. 9-14, 2006, (Qi Yunhui, Wang Shuwang, Pan Junqi, Liu Zhiifeng and Hong C. Zhang),
“A Framework for Environmental Impact Assessment Tools: Comparison Validation and Application Using Case Study of Electronic Products,” Proceedings of the IEEE International Symposium on Electronics and the Environment, pp. 210-214, 2005, ( Rohit Kulkarni and Hong C. Zhang),
Disassembly Analysis, Material Composition Analysis and Environmental Impact Analysis for Computer Drives,” Proceedings of the IEEE International Symposium on Electronics and the Environment, pp. 215-220, 2005, (Sunil Mohite and Hong C. Zhang),
Evaluation Obsolete Electronic Products for Disassembly, Materials Recovery, and Environmental Impact Through a Decision Support System,” Proceedings of the IEEE International Symposium on Electronics and the Environment, pp. 221-225, 2005, (Puneet Shrivastava, and Hong C. Zhang),
Scientific and professional societies of which a member
International Institution for Production Engineering Research (CIRP) – Corresponding Member
The Institute of Electrical Electronics Engineers (IEEE) - Member
Institute of Industrial Engineers (IIE) – Senior Member
Society of Manufacturing Engineers (SME) – Senior Member
American Society of Mechanical Engineers (ASME) – Senior Member
American Society of Engineering Education (ASEE) - Member
North American Manufacturing Research Institution (NAMRI)
Society of Design and Process Science (SDPS) – Founding Member
Phi Beta Delta
Honors and awards
Honor Professor, Shandong University of Science and Technology, 2002-present
Honor Professor, Tianjin University of Science and Technology, 1995-present
Institutional and professional service in the last five years
Organizing Committee Chairman, the 17th CIRP International Conference on Life Cycle Engineering (LCE 2010) 19-21, May 2010.
International Scientific Committee Member of the 18th CIRP International Conference on Life Cycle Engineering (LCE 2011), 2011.
International Scientific Committee Member of the 16th CIRP International Conference on Life Cycle Engineering (LCE 2009), Cairo, Egypt, April 28, - May 2, 2009.
Proposal review committee member of Society of Manufacturing Engineers Education Foundation, 1998-2006
Editorial Board Member, International Journal of Sustainable Manufacturing, published by InterScience Publishers, Olney, Bucks, UK since 2007.
Editorial and Advisory Board Member of Chinese Journal of Mechanical Engineering, Beijing, China since 2003-present.
Peer Review, University Research Grants Council of Hong Kong, 1997-present
Peer Review, Natural Sciences and Engineering Research Council of Canada, 1997-present
Peer Review, City University of Hong Kong, Research Committee, 1997-present
Associate Editor, IEEE Transactions on Components, Packaging, and Manufacturing Technology, IEEE Corp., New York
Advisory Board Member, International Journal of Advanced Manufacturing Technology, published by Springer London, UK
Journal Reviewer for the following: IIE Transactions, Journal of Manufacturing Systems, Transactions of ASME on Journal of Manufacturing Science and Engineering, International Journal of Production Research, International Journal of Advanced Manufacturing Technology, Journal of Product and Process Development, International Journal of Robotics and Computer-Integrated Manufacturing, Computer and Industrial Engineering, Information Sciences: An International Journal, and European Journal of Operation Research
Program Vice Chairman of the 8 th World Conference on Integrated Design and Process Technology, 2005
Executive Committee Member of the CE3 Concurrent Engineering Research and Application, 2005
Program Committee member of The 8th International Conference on Frontiers of Design and Manufacturing, 2008.
Program Vice Chairman of the 8 th World Conference on Integrated Design and Process Technology, 2005.
Program Committee member of The 7th International Conference on Frontiers of Design and Manufacturing, 2006.
Executive Committee Member of the CE3 Concurrent Engineering Research and Application, CE2005.
IEEE Technical Committee of Electronics and Environment, 1995-present
Proposal Review Committee of Society of Manufacturing Engineers Education Foundation, 1998-present
For more information, contact:
Dr. Hong C. Zhang
Department of Industrial Engineering
Texas Tech University
Box 43061
Lubbock, TX 79409-3061
(806) 742-3543
hong-chao.zhang@ttu.edu