Three-Dimensional Heterogeneous Integration (3DHI)

Highlights:

3DHI is a MS EE program that provides a concentration on the 3D Heterogeneous Integration of Integrated Circuits (ICs) with other microfabricated devices including MEMS, RF, and photonic.

The program is supported by DARPA and the State of Texas.

Students will gain hands-on experience in laboratory facilities, take relevant courses, complete an internship with a semiconductor company, and receive a generous scholarship ($30,000 + tuition for up to 3 semesters).

Description:

The 3DHI prepares students for professional careers in semiconductor design and manufacturing. The purpose of the program is to help meet the enormous demand for trained semiconductor engineers, especially in the emerging realm of 3D integration. The curriculum is designed to provide students with a working knowledge of both the theory and practice of semiconductor design and manufacturing. Students accepted into this program take course work and complete an internship at a semiconductor company.

Working with the expert faculty at TTU and in industrial facilities with industry mentors provides the student with the foundation necessary to make a positive contribution as a semiconductor engineer immediately upon graduation. The program provides a broad background in semiconductor technology, including manufacturing, testing, process, design, failure analysis, and business concepts.

Application: https://www.surveymonkey.com/r/TTU-MSEE-3DHI

Contact: Tim.Dallas@ttu.edu (3DHI Director)